What is Dual Inline Package (DIP)?

Dual in-line package, also known as DIP package or DIP packaging, referred to as DIP or DIL, is a packaging method for integrated circuits, which are rectangular in shape and have two parallel rows of metal pins on either side of them, called row pins. Inserted in the DIP socket.

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DIP packaged components are generally referred to as DIPn, where n is the number of pins, for example, the fourteen-pin integrated circuit is called DIP14, the overview figure is the DIP14 integrated circuit.

History of Dip Packaging

DIP was introduced in the s and was a mainstay for a decade before the introduction of surface mount technology. DIP uses a plastic enclosure around the actual semiconductor and has two parallel rows of protruding electrical pins, called leadframes, that connect to the PCB (printed circuit board) below.

The actual die is then connected via bonding wires to two leadframes that can be connected to a printed circuit board (PCB).

Like many early semiconductor inventions, the DIP was created by Fairchild semi in . the DIP package is a retro iconic design and the design choice is understandable. The actual die will be completely sealed with resin, resulting in high reliability and low cost, and many of the earliest iconic semiconductors were packaged in this manner. Note that the die is connected to an external lead frame via wires, making it a "lead bonding" packaging method.

Here is the Intel - actually one of the first modern microprocessors. Note that it is in the iconic DIP package. So if you see those funky pictures of semiconductors that look like little spiders, that means it's a DIP package class semiconductor.

Different Structural Forms of Dip Packaging

• Multi-layer ceramic double in-line DIP
• Single-layer ceramic double in-line DIP
• Leadframe DIP (including glass-ceramic sealed type, plastic encapsulated structure type, ceramic low melt glass package type)

Number of Pins and Spacing

Commonly used DIP packages comply with JEDEC standards, the spacing between the two pins (pin spacing) is 0.1 inches (2.54 mm). The distance between the two rows of pins (row spacing, row spacing) depends on the number of pins, the most common being 0.3" (7.62 mm) or 0.6" (15.24 mm). Other less common distances are 0.4" (10.16 mm) or 0.9" (22.86 mm), and some packages are 0.07" (1.778 mm) between pins, and 0.3", 0.6" or 0.75" between rows.

The DIP packages used in the former Soviet Union and Eastern European countries are roughly close to the JEDEC standard, but the pin spacing uses the metric system of 2.5 mm instead of the 0.1" (2.54 mm) from the imperial system.

The number of pins in a DIP package is always an even number. If the line spacing is 0.3", a pin count of 8 to 24 is common, and occasionally you will see packages with a pin count of 4 or 28. If the line spacing is 0.6", the common pin counts are 24, 28, 32 or 40, and packages with pin counts of 36, 48 or 52 are also available. CPUs such as the Motorola and Zilog Z180 have a pin count of 64, which is the maximum number of pins for common DIP packages.

Orientation and Pin Numbering

When the component is identified with the notch facing up, the topmost pin on the left is pin 1, and the other pins are numbered in counterclockwise order. Sometimes pin 1 will also be marked with a dot.

For example, for DIP14 IC, when the identification notch is facing up, the pins on the left side are pins 1 to 7 in order from top to bottom, while the pins on the right side are pins 8 to 14 in order from bottom to top.

Advantages of DIP

• Ease of soldering: The through-hole mounting technology makes DIP packages relatively easy to solder manually or with automated processes.
• Accessibility: The pins of DIP packages are readily accessible, allowing for easy testing, troubleshooting, and socketing.
• Reliability: DIP packages offer a secure mechanical connection due to the through-hole mounting, making them resistant to mechanical stress and vibration.

Features

It is suitable for soldering through holes on PCB (printed circuit board) and easy to operate.

The ratio between chip area and package area is larger, so the volume is also larger.

The earliest CPUs such as the , , , and all used the DIP package, which could be inserted into a slot on the motherboard or soldered to the motherboard through the two rows of pins on it.

DIP is also a derivative of SDIP (Shrink DIP), which has a six times higher pin density than DIP.

DIP is also short for dip switch, and its electrical characteristics are:

1. electrical life: each switch in the voltage 24VDC and current 25mA under the test, can be toggled back and forth times;;
2. The switch does not often switch the rated current: 100mA, withstand voltage 50VDC;
3. Switch often switch the rated current: 25mA, 24VDC;
4. contact impedance: (a) the initial value of the maximum 50mΩ; (b) the maximum value of 100mΩ after testing; 5. insulation impedance: minimum 100mΩ, 500VDC;
6. Withstand voltage strength: 500VAC / 1 minute;
7. inter-pole capacitance: maximum 5pF;;
8. circuit: single contact single selection: DS (S), DP (L).

In addition, the digital aspect of the film
DIP (Digital Image Processor) secondary actual image

Applications of DIP

Integrated circuits often use DIP packaging, other commonly used DIP packaging parts include DIP switches, LEDs, seven-segment displays, strip displays and relays. Computer and other electronic devices are also commonly used DIP-packaged connectors for the liner.

The earliest DIP packaging components were invented by Bryant Buck Rogers of Quick Semiconductor in , the first component with 14 pins, quite similar to today's DIP packaging components. Its shape is rectangular, compared to earlier round components, rectangular components can increase the density of components in the board. dip packaging components are also very suitable for automated assembly equipment, the board can have dozens to hundreds of ICs, the use of wave soldering machine to weld all the parts, and then tested by automatic test equipment, only a few manual work. dip components are actually larger than their internal The size of DIP components is actually much larger than the integrated circuits inside them. At the end of the 20th century, surface mount technology (SMT) packaged components could reduce the size and weight of the system. However, there are still some occasions where DIP components are used, for example, when prototyping circuits, DIP components are used with breadboards to create circuit prototypes for easy insertion and removal of components.

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Understanding DIP: Dual In-line Package Explained

Dual In-line Package (DIP) CPU chips have been key&#;in microelectronics, offering a practical, reliable design that simplifies assembly and ensures versatility. With dual rows of parallel pins, these chips were initial in circuit board design, allowing easy socket insertion or soldering. Over time, DIP packaging has adapted to diverse configurations, materials, and sealing methods for specific needs. This article explores DIP basics, their historical importance, and their ongoing role in modern electronics, covering structure, pin configurations, applications, and derivative packages. Whether prototyping or studying legacy systems, discover the lasting impact of DIP technology.

Catalog

Overview

DIP (Dual In-line Package) CPU chips stand out with their distinctive design featuring two parallel rows of pins. This thoughtful engineering allows for smooth insertion into compatible chip sockets or direct mounting onto circuit boards that have matching solder hole configurations. The process of inserting and removing these chips requires careful attention; any mishandling could result in pin damage, which might subsequently lead to functionality issues or even complete chip failure.

The DIP package is not a singular entity; it comprises a range of configurations, such as multilayer ceramic, single-layer ceramic, and lead frame types. Each of these variations brings its own set of characteristics that can significantly affect performance and suitability for various applications. For example, multilayer ceramic packages are often the preferred choice in high-frequency applications, owing to their exceptional electrical performance and thermal stability. Conversely, plastic encapsulation serves as a budget-friendly option for mass production, effectively balancing performance with cost considerations.

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In addition, the selection of packaging methods&#;such as glass ceramic sealing or low melting glass packaging&#;significantly impacts the chips' longevity and reliability. Glass ceramic sealing, for instance, offers outstanding protection against environmental challenges, thereby enhancing the chip's durability in demanding conditions. This aspect becomes particularly important in industries where chips endure extreme temperatures or moisture, such as automotive or aerospace sectors.

Applications of DIP

DIP (Dual In-line Package) packaging has been an initial element in integrated circuits, encompassing a wide range of components such as DIP switches, LEDs, seven-segment displays, bar graph displays, and relays. Introduced in by Bryant Buck Rogers of Express Semiconductor with a 14-pin variant, its rectangular design offered a compact and efficient arrangement compared to older round components. DIP connectors also became basic to computer and electronic cabling systems, reinforcing their versatility and widespread use.

The design of DIP packages excels in automated assembly processes, enabling efficient techniques like wave soldering to handle multiple integrated circuits simultaneously, significantly reducing manual labor. Their compatibility with breadboards has made them requisite for prototyping, allowing you to swap components effortlessly during design iterations. This adaptability ensured their popularity in various applications, mostly in the s and s when DIP packages dominated the microelectronics landscape.

However, as the industry evolved, surface-mount packages such as PLCC and SOIC surpassed DIP in mass production efficiency. While these newer formats are less compatible with breadboarding, adapters now enable surface-mount devices (SMDs) to integrate into DIP configurations, bridging modern technology with traditional prototyping needs. Although DIP packages were historically favored for programmable components like EPROMs and GALs due to their compatibility with external programming devices, the shift toward in-system programming (ISP) and compact designs has largely transitioned new programmable components to surface-mount formats, reflecting the industry's focus on miniaturization and efficiency.

Structure of DIP

DIP (Dual In-line Package) chips are primarily encased in either plastic or ceramic materials, each offering unique benefits tailored to various application requirements. Ceramic packages are mostly esteemed for their exceptional airtightness, making them a favored option in high-reliability sectors such as aerospace and medical devices. These environments necessitate remarkable durability and strong resistance to environmental influences, qualities that ceramic materials naturally possess. The longevity and stability of ceramic encasements ensure that the chips retain their functionality over extended durations, even when faced with harsh conditions.

On the other hand, most DIP chips are typically housed in thermosetting resin plastic. This material is appreciated for its rapid processing capabilities, allowing you to produce substantial quantities of chips with remarkable efficiency. The swift production capabilities of thermosetting plastics not only address the rising demand for electronic components but also align with the fast-evolving landscape of high-tech advancements. This manufacturing efficiency plays a substantial role, enabling you to introduce innovations to the market promptly, thus meeting consumer expectations for cutting-edge technology.

In addition, the selection of packaging material has a profound impact on the thermal and electrical performance of the chips. While thermosetting plastics offer advantages for large-scale production, they may lack the thermal conductivity that ceramics provide. This aspect becomes mostly used in applications where effective heat dissipation is a must, such as in high-performance computing or power management systems. Consequently, you can frequently encounter the challenge of balancing production efficiency with performance needs, sparking ongoing discussions about the most suitable materials for specific applications.

Number of Pins and Pitch of DIP

Parameter
Details
Pitch (Pin Spacing)
- Common: 0.1 inches (2.54 mm)
- Less Common: 0.07 inches (1.778 mm)
Row Spacing
- Common: 0.3 inches (7.62 mm), 0.6 inches (15.24 mm)
- Less Common: 0.4 inches (10.16 mm), 0.9 inches (22.86 mm), 0.75 inches (19.05 mm)
Metric Pitch
- Soviet/Eastern European Standard: 2.5 mm
Number of Pins (0.3&#; Spacing)
- Common: 8, 16, 20, 24
- Rare: 4, 28
Number of Pins (0.6&#; Spacing)
- Common: 24, 28, 32, 40
- Rare: 36, 48, 52
Maximum Number of Pins
- Motorola and Zilog Z180 CPUs: 64 pins

Direction and Pin Number of DIP

When the identification notch of a component is positioned upward, the pin located at the top left is marked as pin 1. The remaining pins are then numbered in a counterclockwise direction. This systematic method plays a notable role in establishing correct connections and ensuring the functionality of integrated circuits (ICs). For example, in a DIP14 IC, pin 1 is situated on the left side at the top, with pins 1 through 7 descending on the left and pins 8 through 14 ascending on the right.

Grasping the orientation of pins is active for effective electronic circuit design and implementation. Misidentifying PINs can lead to incorrect connections, which may cause circuit failure or damage to components. This highlights the necessity for meticulous attention to detail during the assembly process. You can often cultivate a practice of cross-referencing pin configurations with datasheets before soldering components onto a PCB. Such diligence not only reduces the likelihood of errors but also contributes to the overall reliability of the final product.

The pin numbering system serves as a standard that promotes interoperability among various components. Familiarizing oneself with the pinout diagrams provided proves advantageous when designing a circuit. These diagrams act as visual aids, clearly depicting the function of each pin along with its corresponding number. Additionally, maintaining a consistent method for labeling and documenting pin configurations during prototyping can greatly facilitate troubleshooting and future modifications.

Further Derivative Packages

The SOIC (Small Outline IC) package stands out as a widely embraced surface mount technology mostly favored in consumer electronics and personal computers. Its design is a more compact variation of the standard PDIP (Plastic Dual In-line Package), featuring pins arranged on both sides to maximize space efficiency. This thoughtful design resonates with the growing trend towards miniaturization in modern electronics, where compactness is not just a preference but a necessity driven by consumer demands.

In addition to SOIC, other similar packaging methods contribute to the industry landscape. These include:

&#; SOJ (Small Outline J-lead): Often chosen for memory devices, SOJ packages boast specific pin configurations that enhance both connectivity and performance.

&#; SOP (Small Outline Package): Known for offering a wider variety of pin counts and sizes, SOP packages provide versatility across numerous applications.

When selecting a package type, a range of design considerations come into play, each with its own implications.

&#; Thermal performance: The capacity of a package to effectively dissipate heat is dominant; inadequate heat management can jeopardize the reliability of the device.

&#; Material choice: The selection of materials plays a crucial role in the overall integrity and longevity of the package.

&#; Pin layout: The arrangement of pins can significantly affect electromagnetic interference (EMI) characteristics, which are dynamic in densely populated circuit boards.

By carefully observing these factors, you can create more resilient packages that not only meet current technical demands but also endure the test of time.

Features of DIP Packages

Feature
Description
Ease of Operation
Suitable for perforating and soldering on PCB (printed circuit board), easy to operate.
Chip-to-Package Area Ratio
The ratio between the chip area and the package area is large, resulting in a larger volume.
Historical Use in CPUs
Used in the earliest CPUs like , , , and . The two rows of pins can be inserted into motherboard slots or soldered directly.
Popularity in Memory Particles
In the era when memory particles were directly plugged onto the motherboard, DIP packaging was widely used.
SDIP (Shrink DIP) Derivative
Offers six times higher pin density compared to traditional DIP packaging.
DIP as a Switch
DIP also refers to DIP switches, with specific electrical characteristics:
 -Electrical Life: Tested under 24VDC voltage and 25mA current, lasting up to toggles.
- Rated Current (Not Switched Frequently): 100mA, withstands 50VDC.
- Rated Current (Frequently Switched): 25mA, withstands 24VDC.
- Contact Impedance: (a) Initial value: 50mΩ maximum; (b) Post-test value: 100mΩ maximum.
- Insulation Resistance: Minimum 100mΩ at 500VDC.
- Compressive Strength: 500VAC for 1 minute.
- Polar Capacitance: Maximum 5pF.
- Loop Type: Single contact single selection: DS(S), DP(L).

DIP (Digital Image Processor) 2D&#;Image

Utilization of DIP-Packaged Chips

DIP-packaged chips, identifiable by their dual rows of pins, present a flexible solution for incorporation into various electronic systems. These chips can be easily soldered into DIP sockets or directly onto circuit boards. This method of through-hole soldering not only simplifies the assembly process but also resonates with the hands-on nature of learning and experimentation. Such ease of use is mostly advantageous in educational environments and prototyping scenarios, where the ability to quickly iterate designs is highly valued.

Nevertheless, while the design of DIP packages promotes compatibility with motherboards, several challenges warrant consideration. The larger footprint and increased thickness of these packages can create spatial limitations on densely populated circuit boards. Additionally, the exposed pins are susceptible to damage during handling, potentially exposing the reliability of connections. Practical experience indicates that careful handling practices and protective measures, such as using anti-static bags, can help alleviate these concerns.

Typically, DIP packages accommodate a maximum of 100 pins, reflecting a thoughtful balance between functionality and manufacturability. As advancements in CPU integration have progressed, the prevalence of DIP packaging has waned, making way for more compact and efficient packaging technologies. This transition signifies a broader trend in the electronics industry towards miniaturization and enhanced integration, aiming to improve performance while conserving space.

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