Choosing the Right Reflow Process for your PCB Assembly

The established go-to reflow process has been convection reflow, which still stands today as a robust reflow method and is widely used here at Gemini Tec. However, as PCBA technology has progressed, so has the need to consider the process particularly as reflow processes have a close correlation to ensuring product conformance is achieved ahead of any downstream processes. As we advise our customers, any potential risk to the integrity of the board must be removed during the build process ahead of any final test that may be conducted by Gemini or our customer.

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To achieve such joint integrity, we select the best-fit process for our customer&#;s product. Working with convection, vapour phase reflow, vacuum vapour phase, and Nitrogen (N2) reflow affords us this luxury.

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Gemini works with numerous vehicle and automotive-based customers, where it&#;s common to build products with heavy-mass copper and flex-rigid technology. When working with these products, the thermal dissipation must be evenly distributed across the PCBA, which can present a challenge for convection ovens due to the nature of their operation.

Using Asscon process technology and Golden as a heat transfer medium which limits the chemical exchange to a maximum temperature of 240dc, ensuring the PCBA can evenly absorb heat until every component has been reflowed without exceeding this temperature and causing overheating to any component.

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